Liquid could power and cool mobile supercomputers: Michel and his team's idea is to stack hundreds of silicon wafers on top of each other to create three-dimensional processors. Between each layer is a pair of fluidic networks. One of these carries in charged fluid to power the chip, while the second carries away the same fluid after it has picked up heat from the active transistors - effectively creating a microscopic flow battery...
"The use of liquid to cool 3D chips is not new," says Bob Patti, chief technology officer of Tezzaron. "However, using the liquid as a power source as well as for cooling is a concept I haven't seen before."
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