"Because they are formed as a film between two wires, they don't have to be implanted into the silicon surface - as do transistors, which form the storage locations in Flash - so they could be built in layers in 3D"...
The joint effort between HP and Hynix will aim to develop memristor memory chips known as resistive random access memory (ReRAM), with an aim to have the first products ready by 2013.
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